In Win D-Frame 2.0 Now Available
Taoyuan, Taiwan, September 2016 – As part of its 30th anniversary celebration and the 2016 signature product series, In Win Development Inc. has announced the availability of In Win D-Frame 2.0 worldwide.
Embodying the spirit and strength of an off-road motorcycle, the In Win D-Frame 2.0 is the perfect combination of craftsmanship and technology. The D-Frame 2.0 will come in a variety of colors such as: black-and-gold, green and blue-and-white. Targeting gamers and PC modders, the handcrafted metal structure has an innovative, two-way opening mechanism, with quick-release fasteners that allows for easy hardware installation. The motherboard mounting tray is first sandblasted to achieve a refined metallic texture, then TIG (tungsten inert gas) welded in place to reinforce stability. Finally, a unique electro-deposition process creates its ultra-smooth finish.
The In Win D-Frame 2.0’s unique open-frame structure provides an unparalleled view of the internal hardware from any angle. The two tempered glass side panels are retained with In Win 30th anniversary commemorative thumbscrews, and there are specific accommodation for water cooling hardware and high-end components that are typically paired with In Win’s signature chassis.
The In Win D-Frame 2.0 has an innovative and flexible internal layout that allows multiple positioning of: storage, (up to 4x multifunctional brackets) fans, (using the 2x 120mm fan brackets and 1x 3-in-1 fan bracket) water cooling radiators (using the 360mm bracket) and/or a pump/reservoir within the chassis. The brackets use captive screws that provide secure fastening and ease of assembly.
Internally, the motherboard tray supports E-ATX, ATX and micro-ATX sizes with CPU heatsinks up to 165mm high, and up to eight expansion slots featuring graphics cards up to 415mm long. The front panel I/O consists of the latest USB 3.1 Type-C connector, three USB 3.0 ports and HD stereo audio jacks.
Watch the Product Preview Video below
In Win has paired the In Win D-Frame 2.0 with the SIII-1065W power supply; In Win’s second power supply with transparent sections, constructed from high-quality aluminium and tempered glass. The SIII-1065W is designed and manufactured by In Win. It is designed in the shape of an air-cooled engine with aluminium alloy top cover. Internally, it’s constructed using premium 105ºC Japanese aluminum electrolytic capacitors, a double EMI filter, a full bridge with LLC and a 165mm smart fan for silent operation. Overall this provides an efficiency of up to 92 percent. There are four, selectable power modes for internal modular ports, and a rear 3-Amp USB port for high-performance mobile charging. Its fully modular design with low-profile cables simplifies installation and focuses on the neatest, cleanest looking PC build.
|Color||Black/Gold Platinum, White/Blue, Black/Green|
|Case Type||Open-Air Chassis|
|Case Material||Reinforced Steel Tube, Aluminium, Tempered Glass|
|M/B Compatibility||12″ x 13″ E-ATX, ATX, Micro-ATX|
|Expansion Slots||8 x PCI-E Slots|
|Maximum Compatibility||VGA Card Length: 350-415mm (Depends on Mounting Configuration)
VGA Card Height: 173mm (Motherboard Die Surface to Side Panel)
CPU Heatsink Height: 165mm (CPU Die Surface to Side Panel)
|Front Ports||1 x USB 3.1 Type-C
3 x USB 3.0
|Internal Drive Bays||4 x 2.5“/3.5” Multifunctional Brackets|
|Thermal Solution Compatibility||2 x 120mm Fan Brackets (Supports 2 x 120mm Fans)
1 x 3-in-1 Fan Bracket (Supports 3 x 120mm Fans)
Supports 1 x 360mm Radiator
– Front: 90mm Maximum Height Including Fan
– Bottom: 65mm Maximum Height Including Fan
|Power Supply Compatibility||SIII-1065W Internal PSU Included
ATX12V and EPS12V
– Dimension(L x W x H): 210 x 180 x 96 mm
(H x W x D)
|548 x 264 x 726 mm
21.6” x 10.4” x 28.6”
(H x W x D)
with screw height
|548 x 291 x 726 mm
21.6″ x 11.5″ x 28.6″
(H x W x D)
|760 x 346 x 842 mm
29.9″ x 13.6″ x 33.1″
Check out In Win Cases at Amazon