GeIL Announces DDR5-9000 Gaming Memory and Showcases DDR5 10200 at Computex 2024
GeIL today announces a new specification: DDR5-9000 CL40-54-54-112 32GB (2x16GB) optimized for AMD Ryzen 8000G series processors, providing the ultimate system performance for AMD enthusiasts.
DDR5 10200 MT/s with Air Cooling Showcased at Computex 2024
In addition to today’s announcement of DDR5-9000 16GBx2 CL40 1.45V, GeIL will showcase DDR5 10200 MT/s at Computex 2024, demonstrating the pinnacle of memory performance. The achievement of DDR5 10200 MT/s may still rely on increased voltages, but it marks a milestone where hardware enthusiasts can easily take advantage of extreme memory performance using heatsinks and air cooling. Hardcore cooling utilities like LN2 are no longer a necessity for achieving DDR5 10000+ MT/s.
GeIL TUF GAMING ALLIANCE MEMORY
In addition to the well-known EVO V series, GeIL TUF GAMING ALLIANCE MEMORY includes the Active Dual Fan Cooling System design, which greatly helps heat dissipation. The enhanced cooling efficiency ensures optimal stability and performance under the most demanding conditions. GeIL TUF GAMING ALLIANCE MEMORY also offers an RGB SKU without fans to provide users with various product options. Both models will be demonstrated at GeIL’s booth at COMPUTEX 2024.
CUDIMM and CSODIMM for Future DDR5 Platform
CUDIMM and CSODIMM products incorporate the CKD (Client Clock Driver) chip to reduce signal degradation and noise for improved stability and reliability. With enhanced signal integrity, CUDIMM and CSODIMM are designed to support the next-generation DDR5 platform with significant advancements in performance and reliability. GeIL expects to first introduce DDR5 6400 MT/s products to the market and expand to high-speed overclocking SKUs by the end of this year.
CAMM2 and LPCAMM2 Expand GeIL’s Memory Product Line
As the successors of SODIMM products, GeIL’s CAMM2 and LPCAMM2 modules are engineered to meet the needs of next-generation compact and high-performance computing devices with higher efficiency and more flexible design. GeIL’s CAMM2 modules provide faster processing speeds and larger memory capacity for enhanced performance and stability. Space-constrained mini-PCs and high-end laptops, which require large memory capacity as well as high memory bandwidth, can both benefit from CAMM2’s improved efficiency, powerful performance, and compact size. GeIL’s LPCAMM2 modules are ideal for mobile applications such as ultrathin laptops, tablets, and embedded systems, which significantly require low power consumption and lightweight design.
Visit GeIL at Booth I0317a
